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Qualcomm Forges $3 Billion Venture With Japanese Firm

Qualcomm Inc. and Japan-based TDK Corp. have agreed to form a $3 billion joint venture to provide specialized electronics for mobile devices in a deal expected to close by 2017.

The company, to be called RF360 Holdings Singapore PTE Ltd., will focus on radio-frequency (or RF) front-end solutions. The partners announced the plan Jan. 13.

Initially, Qualcomm (Nasdaq: QCOM) will have a 51 percent share of the company. The San Diego semiconductor maker said it will have an option to buy out TDK’s share, which would bring the aggregate transaction value to $3 billion.

TDK plans to transfer certain RF technology to the joint venture, according to a securities filing.

RF front-end technology is expected to be an $18 billion opportunity by 2020, the partners said, citing December research from Mobile Experts.

Qualcomm said the partners want to deliver RF front-end modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments such as the Internet of Things, drones, robotics and automotive.

The companies also said they planned to work together in other areas, including sensors and wireless charging.

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Qualcomm also announced that it has entered a joint venture with the Chinese province of Guizhou to design and sell advanced server chipsets in China.

Qualcomm (Nasdaq: QCOM) will have a 45 percent stake in the partnership, announced Jan. 17 in Beijing. The provincial government will have 55 percent ownership.

The joint venture, initially having $280 million worth of capital, will be called Guizhou Huaxintong Semi-Conductor Technology Co. Ltd.

Qualcomm is providing investment capital and is licensing its server technology to the joint venture.

The partners said Guizhou, in southern China, is an important base for the development of the big data industry and will include a green data center cluster of more than 2.5 million servers for companies including China Telecom, China Unicom and China Mobile.

Qualcomm previously announced it wanted to increase its investments in China.

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Qualcomm said it plans to announce financial results on Jan. 27.

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Qualcomm Inc. nabbed the No. 4 spot on IFI Claims’ ranking of top patent recipients for 2015, with 2,900 patents.

Connecticut-based IFI Claims Patent Services released its rankings Jan. 13.

Qualcomm (Nasdaq: QCOM) rose three places to get the No. 4 spot, behind IBM, Samsung and Canon. IBM was assigned 7,355 patents to reclaim the No. 1 spot. Overall U.S. patent counts are down for the first time since 2007, IFI reported.

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